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Horizontal Grinding Machine SGM-7000
Inside of machine chamber
The SGM-7000 Series enable to grind compound semiconductor wafers to process to flatness in micron unit with less damage.
* This product has been developed in response to requests from end users who want to significantly shorten grinding time.
* Sapphire, GaN, GaAs, SiC, Silicone water. Less damage back grinding than ever.
* The best choice for back grinding of fragil substrate.
Maximum Work size : 200 ㎜
Machine Size：W1300 x D590 x H1550 ㎜
【Wafers can be processed with fixed grinding wheel】
- Reduction in overwhelming processing time and drastic improvement in yield.
- Running costs can be reduced compared to Lapping and Polish.
【Comparison with competitors】
New mechanism design for grinding wheel swinging back and forth.
- Grinding with less damage is possible.
- Enable to grind wafer onward to the much high-caliber thinness in stead of lapping.
- - Delivered to most LED manufacturers in Japan. Hundreds of units have been delivered overseas.
- - There are many dealing with semiconductor device maker and research institutes such as universities.
Expected customers and business partners
Device maker / wafer maker dealing with compound semiconductors.